WTO commitments (CTS)
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Chinese Taipei
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Afghanistan
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Chinese Taipei
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Notes and disclaimers:
1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/chinese-taipei )Chinese Taipei
- Schedule number
- CLIII
- Harmonized System version
- HS 2012
- WTO Membership since
- 01 January, 2002
- This schedule is authentic in
- English
- Date of last schedule updated
- 27 September, 2019
| Item | Description | HS 1996 |
|---|---|---|
|
113
|
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers
|
70200012
|
|
114
|
Chemical vapor deposition apparatus for semiconductor production
|
ex84198990, ex84798990
|
|
115
|
Parts of chemical vapor deposition apparatus for semiconductor production
|
ex84199000, ex84799090
|
|
122
|
Apparatus for stripping or cleaning semiconductor wafers
|
84569100
|
|
125
|
Lasercutters for cutting contacting tracks in semiconductor production by laser beam
|
ex84569990, ex84561000
|
|
126
|
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips
|
ex84641000
|
|
129
|
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips
|
ex84669100
|
|
130
|
Parts of dicing machines for scribing or scoring semiconductor wafers
|
ex84669100
|
|
133
|
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam
|
ex84669300
|
|
135
|
Parts of apparatus for stripping or cleaning semiconductor wafers
|
ex84669300
|
|
137
|
Encapsulation equipment for assembly of semiconductors
|
ex84771000
|
|
138
|
Parts of encapsulation equipment
|
ex84779000
|
|
139
|
Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices
|
ex84795090
|
|
141
|
Apparatus for physical deposition by sputtering on semiconductor wafers
|
ex85431100, ex84798990
|
|
142
|
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays
|
ex84798990
|
|
143
|
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors
|
ex84798990
|
|
144
|
Encapsulation equipment for assembly of semiconductors
|
ex84798990
|
|
146
|
Machines for bending, folding and straightening semiconductor leads
|
ex84798990
|
|
147
|
Physical deposition apparatus for semiconductor production
|
ex84798990
|
|
148
|
Spinners for coating photographic emulsions on semiconductor wafers
|
ex84798990
|
|
149
|
Part of apparatus for physical deposition by sputtering on semiconductor wafers
|
ex84799090, ex85439000
|
|
150
|
Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors
|
ex84799090
|
|
151
|
Parts for spinners for coating photographic emulsions on semiconductor wafers
|
ex84799090
|
|
153
|
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays
|
ex84799090
|
|
154
|
Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices
|
ex84799090
|