WTO commitments (CTS)
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Chinese Taipei
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Afghanistan
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Notes and disclaimers:
1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/chinese-taipei )Chinese Taipei
- Schedule number
- CLIII
- Harmonized System version
- HS 2012
- WTO Membership since
- 01 January, 2002
- This schedule is authentic in
- English
- Date of last schedule updated
- 27 September, 2019
| Item | Description | HS 2007 |
|---|---|---|
|
192
|
Multi-component integrated circuits (MCOs): a combination of one or more monolithic, hybrid, or multi-chip integrated circuits with at least one of the following components: silicon-based sensors, actuators, oscillators, resonators or combinations thereof, or components performing the functions of articles classifiable under heading 8532, 8533, 8541, or inductors classifiable under heading 8504, formed to all intents and purposes indivisibly into a single body like an integrated circuit, as a component of a kind used for assembly onto a printed circuit board (PCB) or other carrier, through the connecting of pins, leads, balls, lands, bumps, or pads.
For the purpose of this definition the following expressions mean:
1. " Components" may be discrete, manufactured independently then assembled onto the rest of the MCO, or integrated into other components.
2. "Silicon based" means built on a silicon substrate, or made of silicon materials, or manufactured onto integrated circuit die.
3(a). "Silicon based sensors" consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical quantities and transducing these into electric signals, caused by resulting variations in electric properties or displacement of a mechanical structure.
"Physical or chemical quantities" relates to real world phenomena, such as pressure, acoustic waves, acceleration, vibration, movement, orientation, strain, magnetic field strength, electric field strength, light, radioactivity, humidity, flow, chemicals concentration, etc.
3(b). "Silicon based actuators" consist of microelectronic and mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of converting electrical signals into physical movement.
3(c). "Silicon based resonators" are components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures in response to an external input.
3(d). "Silicon based oscillators" are active components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures.
|
84733000, 84735000, 85176200, 85176900,
85177000, 85181010, 85189010, 85299090,
85319090, 85423900, 85439040, 85489010, 90259000, 90269000, 90279090, 90309090,
90319090, 90329000, 95041000, 95043010,
95043090, 95049090
|
|
193
|
Light-Emitting Diode (LED) Backlights modules, which are lighting sources that consist of one or more LEDs, and one or more connectors and are mounted on a printed circuit or other similar substrate, and other passive components, whether or not combined with optical components or protective diodes, and used as backlights illumination for liquid crystal displays (LCDs)
|
84733000, 85299090
|
|
194
|
Touch-Sensitive Data Input Devices (so-called touch screens) without display capabilities, for incorporation into apparatus having a display, which function by detecting the presence and location of a touch within the display area. The sensing of touch may be obtained by means of resistance, electrostatic capacity, acoustic pulse recognition, infra-red lights, or other touch-sensitive technology
|
84716090, 84733000, 85177000, 85489090(ex)
|
|
195
|
Ink cartridges (with or without an integrated print head) for insertion into apparatus of HS subheadings 844331, 844332 or 844339, and incorporating mechanical or electrical components; thermoplastic or electrostatic toner cartridges (with or without moving parts) for insertion into apparatus of HS subheadings 844331, 844332 or 844339; solid ink in engineered shapes for insertion into apparatus of HS subheadings 844331, 844332 or 844339
|
32151100(ex), 32151900(ex), 84439900
|
|
196
|
Printed matter which grants the right to access, install, reproduce or otherwise use software (including games), data, internet content (including in-game or in-application content) or services, or telecommunications services (including mobile services)**
** The tariff elimination for printed matter shall only affect the rights and obligations with respect to trade in goods, that is, it shall not affect market access other than tariffs of the participants. Nothing in the ITA expansion agreement shall prevent an ITA member from regulating the content of such goods, including Internet content, among other things. Nothing in the ITA expansion agreement shall affect a member’s market access rights and obligations on trade in services or prevent a member from regulating its services market.
|
49119900
|
|
197
|
Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
|
39199090(ex), 59119000(ex), 84869000
|
|
198
|
Boxes, cases, crates and similar articles, of plastic, specially shaped or fitted for the conveyance or packing of semiconductor wafers, masks, or reticles, of subheading 392310 or 848690
|
39231000(ex), 84869000
|
|
199
|
Vacuum pumps of a kind used solely or principally for the manufacture of semiconductors or flat panel displays
|
84141000(ex)
|
|
200
|
Plasma cleaner machines that remove organic contaminants from electron microscopy specimens and specimen holders
|
84798990(ex)
|
|
201
|
Portable interactive electronic education devices primarily designed for children
|
85437099(ex), 95030093, 95041000
|