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Notes and disclaimers:

1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/japan )

Japan

Schedule number: XXXVIII
Harmonized System version: HS 2002
WTO Membership since: 01 January, 1995
This schedule is authentic in: English
Date of last schedule updated: 15 June, 2009

Section	Note Number	Note
Part I Section IA	1	Please refer to the Original_Notes table
Part I Section IB		The quota quantities for dairy products include quantities available for the products for consumption in the cruise of international maritime vessels and international airlines (1 ton of skimmed milk powder, 0.3 ton of whole milk powder, 85 tons of evaporated milk, 13 tons of condensed milk and 29 tons of butter). The quota quantities for dairy products also include quantities available for the products for outward processing trade (10,904 tons of skimmed milk powder and 1,263 tons of butter and butteroil). The terms equivalent to those existing of these access opportunities shall be maintained during the implementation period. // "Fat" means the proportion of milk fat content, by weight, of the products concerned.
Part I Section II	2	Please refer to the Original_Notes table
Part I Section II	3	Please refer to the Original_Notes table
Part I Section II	4	Please refer to the Original_Notes table
Part IV		The Government of Japan undertakes not to introduce the export subsidies listed in paragraph 1 of Article 9 of the Agreement on Agriculture
Annex ITA		1. Notwithstanding the provision of paragraph 3 of the Notes to the Schedule, the tariff reductions from the bound rate as of 1 January 1997 to free in respect of all products classified (or classifiable) in the tariff item numbers in List I shall be implemented in three equal rate reductions as follows : (a) The first reduction shall be implemented on the date that this instrument becomes effective; (b) The second reduction shall be implemented on 1 January 1998; (c) The third reduction shall be implemented on 1 January 1999. 2. Notwithstanding the provision of paragraph 3 of the Notes to the Schedule, the tariff reductions from the bound rate as of 1 January 1997 to free in respect of all products classified (or classifiable) in the tariff item numbers in List II shall be implemented in four equal rate reductions as follows: (a) The first reduction shall be implemented on the date that this instrument becomes effective; (b) The second reduction shall be implemented on 1 January 1998; (c) The third reduction shall be implemented on 1 January 1999; (d) The fourth reduction shall be implemented on 1 January 2000. Of the products classified (or classifiable) in the tariff item numbers marked with an asterisk (""), only those of a kind used for telecommunications are covered by the tariff reduction. 3. Notwithstanding the provision of paragraph 3 of the Notes to the Schedule, the tariff reductions from the bound rate as of 1 January 1997 to free in respect of the products in Lists III and IV, wherever they are classified, shall be implemented in three equal rate reductions as follows: (a) The first reduction shall be implemented on the date that this instrument becomes effective; (b) The second reduction shall be implemented on 1 January 1998; (c) The third reduction shall be implemented on 1 January 1999. 4. Rounding of the rates after each reduction implemented pursuant to paragraphs 1-3 above shall be subject to the provisions in paragraph 5 of the Notes to the Schedule. List I 8421.91, 8424.89, 8424.90, 8464.20, 8464.90, 8466.91, 8466.93, 8469.11, 8470.10, 8470.21, 8470.29, 8470.30, 8470.90, 8471.10, 8471.30, 8471.41, 8471.49, 8471.50, 8471.60, 8471.70, 8471.80, 8471.90, 8473.21, 8473.29, 8473.30, 8473.50, 8480.71, 8504.40, 8504,50, 8518.10, 8518.29, 8518.30, 8520.20, 8523.90, 8524.31, 8524.39, 8524.40, 8524.91, 8524.99, 8525.40, 8532.10, 8533.10, 8533.21, 8533.29, 8533.31, 8533.39, 8533.40, 8536.50, 8541.10, 8541.21, 8541.29, 8541.30, 8541.40, 8541.50, 8541.60, 8542.12, 8542.13, 8542.14, 8542.19, 8542.30, 8542.40, 8542.50, 8542.90, 8543.11, 8544.70, 9026.10, 9026.20, 9026.80, 9026.90, 9027.30, 9027.80, 9027.90, 9030.90, 9031.41, 9031.49, 9031.90 List II 3818.00, 8544.41, 8544.49, 8544.51 List III1 Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers Chemical vapor deposition apparatus for semiconductor production Parts of chemical vapor deposition apparatus for semiconductor production Apparatus for stripping or cleaning semiconductor wafers Lasercutters for cutting contacting tracks in semiconductor production by laser beam Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips Parts of dicing machines for scribing or scoring semiconductor wafers Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam Parts of apparatus for stripping or cleaning semiconductor wafers Encapsulation equipment for assembly of semiconductors Parts of encapsulation equipment Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices Apparatus for physical deposition by sputtering on semiconductor wafers Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Machines for bending, folding and straightening semiconductor leads Physical deposition apparatus for semiconductor production Spinners for coating photographic emulsions on semiconductor wafers Parts of apparatus for physical deposition by sputtering on semiconductor wafers Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Parts for spinners for coating photographic emulsions on semiconductor wafers Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices Parts of encapsulation equipment for assembly of semiconductors Parts of machines for bending, folding and straightening semiconductor leads Parts of physical deposition apparatus for semiconductor production Apparatus for rapid heating of semiconductor wafers Parts of apparatus for rapid heating of wafers Wafer probers Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Parts of such pattern generating apparatus Note 1. "Parts" for the purpose of this List means those classified in headings specified in accordance with Note 2(b) to Section XVI and Note 2(b) to Chapter 90 of International Convention on the Harmonized Commodity Description and Coding System. List IV1 Computers2 : Automatic data processing machines3 capable of; (a) storing the processing program or programs and at least the data immediately necessary for the execution of the program (b) being freely programmed in accordance with the requirements of the user; (c) performing arithmetical computations specified by the user; and (d) executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run. Electric amplifiers used as repeaters in line telephony products falling within this Attachment, and parts thereof. Flat panel displays (including LCD, Electro Luminescence, Plasma, Vacuum Fluorescence and other technologies) for products falling within this Attachment, and parts thereof. Network equipments : Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units -- including adapters, hubs, in-line repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof. Monitors : Display units of automatic data processing machines4 with a cathode ray tube with a dot screen pitch smaller than 0.4mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing units of computers as defined above. Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, and whether or not in their own housings Paging alert devices, and parts thereof. Plotters whether input or output units of HS heading No 8471, and whether drawing or drafting machines of HS heading No 9017. Printed circuit assemblies5, for products falling within this Attachment, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Projection type flat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit. Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units. Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the automatic data processing machines and units thereof to process audio signals (sound cards). Set top boxes which have a communication function : Microprocessor-based devices incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange. Notes 1. "Parts" for the purpose of this List means those classified in headings specified in accordance with Note 2(b) to Section XVI and Note 2(b) to Chapter 90 of International Convention on the Harmonized Commodity Description and Coding System. 2. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine and not otherwise specified under this Attachment are not covered by this Attachment. 3. This Attachment covers automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. 4. This Attachment does not cover televisions (including high definition televisions). 5. Such printed circuit assemblies consist of one or more printed circuits of HS heading No 8542 with one or more active elements assembled thereon, with or without passive elements. "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of HS heading No 8541, and integrated circuits and micro assemblies of HS heading No 8542.