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Notes and disclaimers:

1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/moldova-republic-of )

Moldova, Republic of

Download CTS file
Schedule number
CLI
Harmonized System version
HS 2017
WTO Membership since
26 July, 2001
This schedule is authentic in
English
Date of last schedule updated
05 May, 2025
Item
Description
HS 1996

113

Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers

702000 050

114

Chemical vapor deposition apparatus for semiconductor production

841989 200

115

Parts of chemical vapor deposition apparatus for semiconductor production

841990 300

122

Apparatus for stripping or cleaning semiconductor wafers

845699 300

125

Lasercutters for cutting contacting tracks in semiconductor production by laser beam

845610 100

126

Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips

846410 100

129

Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips

846691 150

130

Parts of dicing machines for scribing or scoring semiconductor wafers

846691 150

133

Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam

846693 150

135

Parts of apparatus for stripping or cleaning semiconductor wafers

846693 150

137

Encapsulation equipment for assembly of semiconductors

8477 10 100, 8477 59 050, 8479 89 790, 8543 89 730

138

Parts of encapsulation equipment

8477 90 050, 8479 90 500, 8543 90 300

139

Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices

842839 930

141

Apparatus for physical deposition by sputtering on semiconductor wafers

8419 89 250, 8543 89 700

142

Apparatus for wet etching, developing, striping or cleaning semiconductor wafers and flat panel displays

8479 89 750, 8543 30 300, 8479 89 760, 8543 30 100

143

Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors

8479 89 770, 8515 80 050

144

Encapsulation equipment for assembly of semiconductors

8477 10 100, 8477 59 050, 8479 89 790, 8543 89 730

146

Machines for bending, folding and straightening semiconductor leads

8462 21 050, 8462 29 050

147

Physical deposition apparatus for semiconductor production

8419 89 250, 8543 89 720

148

Spinners for coating photographic emulsions on semiconductor wafers

842119 930

149

Parts of apparatus for physical deposition by sputtering on semiconductor wafers

8419 90 300, 8543 90 300

150

Parts for die attach apparatus, tape automated bounders, and wire bounders for assembly of semiconductors

8479 90 500, 8515 90 100

151

Parts for spinners for coating photographic emulsions on semiconductor wafers

842191 100

153

Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays

8479 90 500, 8543 90 300

154

Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer boxes and other material for semiconductor devices

843139 200