WTO commitments (CTS)
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Notes and disclaimers:
1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/moldova-republic-of )Moldova, Republic of
- Schedule number
- CLI
- Harmonized System version
- HS 2017
- WTO Membership since
- 26 July, 2001
- This schedule is authentic in
- English
- Date of last schedule updated
- 05 May, 2025
|
Item
|
Description
|
HS 1996
|
|---|---|---|
|
113 |
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers |
702000 050 |
|
114 |
Chemical vapor deposition apparatus for semiconductor production |
841989 200 |
|
115 |
Parts of chemical vapor deposition apparatus for semiconductor production |
841990 300 |
|
122 |
Apparatus for stripping or cleaning semiconductor wafers |
845699 300 |
|
125 |
Lasercutters for cutting contacting tracks in semiconductor production by laser beam |
845610 100 |
|
126 |
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips |
846410 100 |
|
129 |
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips |
846691 150 |
|
130 |
Parts of dicing machines for scribing or scoring semiconductor wafers |
846691 150 |
|
133 |
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam |
846693 150 |
|
135 |
Parts of apparatus for stripping or cleaning semiconductor wafers |
846693 150 |
|
137 |
Encapsulation equipment for assembly of semiconductors |
8477 10 100, 8477 59 050, 8479 89 790, 8543 89 730 |
|
138 |
Parts of encapsulation equipment |
8477 90 050, 8479 90 500, 8543 90 300 |
|
139 |
Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices |
842839 930 |
|
141 |
Apparatus for physical deposition by sputtering on semiconductor wafers |
8419 89 250, 8543 89 700 |
|
142 |
Apparatus for wet etching, developing, striping or cleaning semiconductor wafers and flat panel displays |
8479 89 750, 8543 30 300, 8479 89 760, 8543 30 100 |
|
143 |
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors |
8479 89 770, 8515 80 050 |
|
144 |
Encapsulation equipment for assembly of semiconductors |
8477 10 100, 8477 59 050, 8479 89 790, 8543 89 730 |
|
146 |
Machines for bending, folding and straightening semiconductor leads |
8462 21 050, 8462 29 050 |
|
147 |
Physical deposition apparatus for semiconductor production |
8419 89 250, 8543 89 720 |
|
148 |
Spinners for coating photographic emulsions on semiconductor wafers |
842119 930 |
|
149 |
Parts of apparatus for physical deposition by sputtering on semiconductor wafers |
8419 90 300, 8543 90 300 |
|
150 |
Parts for die attach apparatus, tape automated bounders, and wire bounders for assembly of semiconductors |
8479 90 500, 8515 90 100 |
|
151 |
Parts for spinners for coating photographic emulsions on semiconductor wafers |
842191 100 |
|
153 |
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays |
8479 90 500, 8543 90 300 |
|
154 |
Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer boxes and other material for semiconductor devices |
843139 200 |