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Notes and disclaimers:

1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/ukraine )

Ukraine

Download CTS file
Schedule number
CLXII
Harmonized System version
HS 2017
WTO Membership since
16 May, 2008
This schedule is authentic in
English
Date of last schedule updated
10 January, 2024
Item Description HS 2002
113
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers
702000 05 00
114
Chemical vapor deposition apparatus for semiconductor production
841989 20 00
115
Parts of chemical vapor deposition apparatus for semiconductor production
841990 25 10
122
Apparatus for stripping or cleaning semiconductor wafers
8456 91 00 00, 8456 99 30 00
125
Lasercutters for cutting contacting tracks in semiconductor production by laser beam
845610 10 00
126
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips
846410 10 00
129
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips
846691 15 10
130
Parts of dicing machines for scribing or scoring semiconductor wafers
846691 15 50
133
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam
846693 15 10
135
Parts of apparatus for stripping or cleaning semiconductor wafers
8466 93 15 30, 8466 93 15 70
137
Encapsulation equipment for assembly of semiconductors
8477 10 10 00, 8477 59 05 00, 8479 89 79 00
138
Parts of encapsulation equipment
8477 90 05 10, 8477 90 05 30, 8479 90 50 00
139
Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices
842839 93 00
141
Apparatus for physical deposition by sputtering on semiconductor wafers
854389 65 00
142
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays
ex8424 89 95 00, ex8464 90 80 00, 8479 89 73 00, 8543 30 20 00
143
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors
8479 89 77 00, 8515 80 05 00, ex8515 80 99 00
144
Encapsulation equipment for assembly of semiconductors
8477 10 10 00, 8477 59 05 00, 8479 89 79 00, 8543 89 73 00
146
Machines for bending, folding and straightening semiconductor leads
8462 21 05 00, 8462 29 05 00
147
Physical deposition apparatus for semiconductor production
854389 65 00
148
Spinners for coating photographic emulsions on semiconductor wafers
847989 98 90
149
Part of apparatus for physical deposition by sputtering on semiconductor wafers
854390 30 30
150
Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors
8479 90 50 00, 8515 90 10 00
151
Parts for spinners for coating photographic emulsions on semiconductor wafers
ex847990 97 00
153
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays
ex8424 90 90 90, ex8466 91 95 00, 8479 90 50 00, 8543 90 30 10
154
Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices
843139 90 10