WTO commitments (CTS)
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Notes and disclaimers:
1. This is an online version of the Consolidated Tariff Schedules (CTS) Database, which is based on standardized data and is not an exact reproduction of the member's Schedules of concessions. In addition, while the data are presented in the authentic language of the Schedule, the headers, description of the sections, and other standardized information are available in English only. 2. The CTS Database was established as a working tool only, without any implications regarding the legal status of the information contained therein. These data are without prejudice to the rights and obligations of WTO members. Goods Schedules hyperlink to be member-specific. 3. The legal instruments and other ongoing procedures that have not yet been certified can be found in the Goods Schedules e-library ( https://goods-schedules.wto.org/member/ukraine )Ukraine
- Schedule number
- CLXII
- Harmonized System version
- HS 2017
- WTO Membership since
- 16 May, 2008
- This schedule is authentic in
- English
- Date of last schedule updated
- 10 January, 2024
|
Item
|
Description
|
HS 2002
|
|---|---|---|
|
113 |
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers |
702000 05 00 |
|
114 |
Chemical vapor deposition apparatus for semiconductor production |
841989 20 00 |
|
115 |
Parts of chemical vapor deposition apparatus for semiconductor production |
841990 25 10 |
|
122 |
Apparatus for stripping or cleaning semiconductor wafers |
8456 91 00 00, 8456 99 30 00 |
|
125 |
Lasercutters for cutting contacting tracks in semiconductor production by laser beam |
845610 10 00 |
|
126 |
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips |
846410 10 00 |
|
129 |
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips |
846691 15 10 |
|
130 |
Parts of dicing machines for scribing or scoring semiconductor wafers |
846691 15 50 |
|
133 |
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam |
846693 15 10 |
|
135 |
Parts of apparatus for stripping or cleaning semiconductor wafers |
8466 93 15 30, 8466 93 15 70 |
|
137 |
Encapsulation equipment for assembly of semiconductors |
8477 10 10 00, 8477 59 05 00, 8479 89 79 00 |
|
138 |
Parts of encapsulation equipment |
8477 90 05 10, 8477 90 05 30, 8479 90 50 00 |
|
139 |
Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices |
842839 93 00 |
|
141 |
Apparatus for physical deposition by sputtering on semiconductor wafers |
854389 65 00 |
|
142 |
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays |
ex8424 89 95 00, ex8464 90 80 00, 8479 89 73 00, 8543 30 20 00 |
|
143 |
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors |
8479 89 77 00, 8515 80 05 00, ex8515 80 99 00 |
|
144 |
Encapsulation equipment for assembly of semiconductors |
8477 10 10 00, 8477 59 05 00, 8479 89 79 00, 8543 89 73 00 |
|
146 |
Machines for bending, folding and straightening semiconductor leads |
8462 21 05 00, 8462 29 05 00 |
|
147 |
Physical deposition apparatus for semiconductor production |
854389 65 00 |
|
148 |
Spinners for coating photographic emulsions on semiconductor wafers |
847989 98 90 |
|
149 |
Part of apparatus for physical deposition by sputtering on semiconductor wafers |
854390 30 30 |
|
150 |
Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors |
8479 90 50 00, 8515 90 10 00 |
|
151 |
Parts for spinners for coating photographic emulsions on semiconductor wafers |
ex847990 97 00 |
|
153 |
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays |
ex8424 90 90 90, ex8466 91 95 00, 8479 90 50 00, 8543 90 30 10 |
|
154 |
Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices |
843139 90 10 |